• Molded 0.3" integrated circuit packing outline allowing automatic insertion
  • Smaller size makes better heat convection during PC board reflow wave soldering
  • Top tape sealed to withstand reflow wave soldering, board washing
  • Housing materials are UL 94V-0 grade fire retardant plastics
  • Gold plated contact to ensure low contact resistance and tin plated terminal to prevent contamination daring soldering
  • RoHS Compliant