Electromechanical Components
EAD
FEATURES
- Same size with IC, can be assembled by any automatic IC inserter.
- Molded 0.3" integrated circuit packing outline allowing automatic insertion.
- Smaller size makes better heat convection during PC board reflow wave soldering.
- Top tape sealed to withstand wave soldering, board washing.
- All plastics are UL 94V-0 grade fire retardant.
- Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering.
- RoHS Compliant