SURFACE MOUNT PTC
SM(1210) MODEL

E175689

Pending

FEATURES

  • 1210 Dimension, surface mount, solid state
  • Faster time to trip than standard SMD devices
  • Lower resistance than standard SMD devices
  • Operation current: 50mA~1.50A
  • Maximum voltage: 6V~60Vdc
  • Temperature range: -40 to 85
  • Tape and reel available on most models

APPLICATIONS

Almost anywhere there High-density boards is a low voltage power supply and a load to be protected including:

  • Computers & peripherals
  • General electronics
  • Automotive applications

PART NUMBERING SYSTEM

  ERF XX XXX XX X X X
   |   |  |   | | | |
   |   |  |   | | | +--- Z:RoHS Compliant
   |   |  |   | | +--- Special number:
   |   |  |   | |      0:Standard product
   |   |  |   | +--- Packing type:
   |   |  |   |      0:bulk
   |   |  |   |      2:tape & reel
   |   |  |   +--- Voltage rating: 60:60V
   |   |  +--- Current rating: 005:0.05A
   |   +--- Model:
   |        SM:Surface mount type, 1210 Dimension
   +--- Product Name: Resettable Fuse

MARKING SYSTEM

ELECTRICAL CHARACTERISTICS (23oC)

Part
Number

Hold
Current

Trip
Current

Rated
Voltage

Maximum
Current

Typical
Power

Max. Time
to trip

Resistance Tolerance

RMIN

R1MAX

IH, A

IT, A

VMAX, Vdc

IMAX, A

Pd, W

Amp

Sec

SM005

0.05

0.15

60

10

0.60

0.25

1.50

3.60

50.00

SM010

0.10

0.25

60

10

0.60

0.50

1.50

1.60

15.00

SM020

0.20

0.40

30

10

0.60

8.00

0.02

0.80

5.00

SM035

0.35

0.70

16

40

0.60

8.00

0.20

0.32

1.30

SM050

0.50

1.00

16

40

0.60

8.00

0.10

0.25

0.90

SM075

0.75

1.50

8

40

0.60

8.00

0.10

0.13

0.40

SM110

1.10

2.20

6

100

0.80

8.00

0.30

0.06

0.21

SM150

1.50

3.00

6

100

0.80

8.00

0.50

0.04

0.11
IH=Hold current-maximum current at which the device will not trip at 23 still air.
IT=Trip current-minimum current at which the device will always trip at 23 still air.
VMAX=Maximum voltage device can withstand without damage at rated current.
IMAX= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated from device when in the tripped state in 23c.gif (75 ????) still air environment.
RMIN=Minimum device resistance at 23.
R1MAX=Maximum device resistance at 23 1 hour after tripping.

Typical time-to-trip-at 23oC

Thermal Derating Curve

SM Product Dimensions (UNIT:mm)

Part
Number

A

B

C

D

E

Figure

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

SM005

3.00

3.43

2.35

2.80

0.60

1.15

0.25

0.75

-----

-----

1

SM010

3.00

3.43

2.35

2.80

0.60

1.15

0.25

0.75

-----

-----

1

SM020

3.00

3.43

2.35

2.80

0.40

0.85

0.25

0.75

-----

-----

1

SM035

3.00

3.43

2.35

2.80

0.40

0.80

0.25

0.75

-----

-----

1

SM050

3.00

3.43

2.35

2.80

0.30

0.75

0.25

0.75

-----

-----

1

SM075

3.00

3.43

2.35

2.80

0.30

0.70

0.25

0.75

-----

-----

1

SM110

3.00

3.43

2.35

2.80

0.60

1.00

0.25

0.75

0.10

0.45

2

SM150

3.00

3.43

2.35

2.80

0.50

0.90

0.25

0.75

0.10

0.45

2

Pad Layouts and Soldering Reflow Recommendations

The dimension in the table below provide the recommended pad layout for each surface mount device

Pad dimensions(millimeters)
Device A
Nominal		 B
Nominal		 C
Nominal

SL MODEL

5.10

2.30

5.60

SD MODEL

3.45

1.78

3.50

SM MODEL

2.00

1.00

2.80

SN MODEL

2.00

1.00

1.90

SR MODEL

 1.20 1.00 1.50

SOLDERING REFLOW (LEAD FREE)

  • Suggested reflow methods: IR, vapor phase oven, hot air oven.

  • Recommended maximum paste thickness is 0.25mm.

  • Devices are not designed to wave soldered to the bottom side of the board.

CAUTION

If reflow temperatures exceed the recommended standard, devices may not be able to meet the performance requirements.

Note: Specifications subject to change without prior notice.