Features

  • End stackable for standard 0.1" integrated circuit pitch.
  • Molded 0.3" integrated circuit packing outline allowing automatic insertion.
  • Smaller size makes better heat convection during PC board reflow wave soldering.
  • Top tape sealed to withstand wave soldering, board washing.
  • All plastics are UL 94V-0 grade fire retardant.
  • Twin contacts designed to ensure stable contact.
  • Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering.
  • RoHS Compliant

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